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Updated time: 10/06 2024.

I. phase transition of Au thinfilm on silica substrate

0. Theory

1. Layer by layer transformation

  • Ref: Layer-by-layer phase transformation in Ti3O5 revealed by machine-learning molecular dynamics simulations, NC

2. How to study the phase transition

  • Energy difference (thickness/strain - film, Bain path/外延贝恩相变路径/静水压 - bulk)
  • EOS
  • Energy barrier (thickness - film,用什么方法去描述中间态,驱动力)
  • Surface energy

3. Energy compare

DFT -> lattice constant is same as the experiment.

Bulk: SiO2, FCC, HCP

Film: FCC, HCP

On substrate: FCC/HCP/more layers/more sustrates

Moleculars: H2O2, … etc

Focused items: total energy, adsorb energy, interface energy, surface energy

4. Electronic structure

  • EOS: Theoretical prediction of a phase transition in gold

5. Other properties

6. Path

  • Bain path

  • surface effect energy

  • MD simulation (thermal, strain, substrate)

7. Ref:

  • Strain and support effects on phase transition and surface reactivity of ultrathin ZnO films: DFT insights
  • Theoretical prediction of a phase transition in gold, PRB
  • Layer-by-layer phase transformation in Ti3O5 revealed by machine-learning molecular dynamics simulations, NC
  • Co HCP ==>> FCC, transition mechanism.

8. Thinking

思考影响因素

  • 应变的影响(需要考虑不同厚度下应变的影响吗)
  • 厚度的影响(对能量差的影响)
  • 面内弹性常数/晶格常数的影响(晶格常数的降低导致了面内弹性常数的上升,晶格常数低会导致产生更小的压缩应变,同时弹性常数高更容易抵抗形变,且应变能在其中的影响也不可忽视)
  • 表面能的影响(厚度、应变对表面能的影响,占比的影响,HCP可能表面能更低,但是得对应同一晶格常数)
  • 化学刻蚀的影响(表面结构不稳定)
  • 上下表面的压力的影响(下表面外延压缩应变、上表面是表面态原子,配位数缺失,导致给体相原子一个压应力,可以通过平衡原子晶格常数计算出来吗)
  • 势垒的影响(层错能?厚度/应变对层错能的影响?块体中层错能和薄膜中层错能的比较,以及薄膜中不同上下区域的层错能)
  • 相变驱动力(层错,可以计算不同厚度薄膜层错依次开动的能量/Atom的变化,直至块体)

复现了PRB文章中关于高压下HCP更稳定的情况

  • Bain phase path - 针对FCC(001)-BCC(001)的相变,对金还没做过
  • 外延Bain phase path - 可以对FCC(111)和HCP(0001)做分析,但是我觉得他两的 c/a 都没什么区别
  • 实验上观察到的HCP薄膜是压应变(2.8/2.96/2.927 —> 2.54 埃 )

II. High modulus and high strength design shceme for FCC/HCP phase

III. Irreversible phase change from graphene to diamane

0. Thinking

  • Saturate the dangling bond
    • plasma
    • solute (H2O2, NaCl, KCl)
  • high pressure
    • AFM
    • DAC
  • high temperature
    • AFM only ~200 ℃, maybe it’s not enough

1. Question

  • 老板那篇Natrue Nano中的 SiC 基底是晶体/非晶?
    • 晶体

2. Difficulty

  • Plasma + Indentation

    • 氢气可行吗,配套的设施
    • 压痕小装置:转移台的操作装置,加一个样品台,阵列探针,电机(可选,或者手拧螺丝)
  • Cypher AFM

    • 水蒸气通(否决,没压力)
    • 如何避免/区别氧化石墨烯?

IV. DFT - different substrate for gold / different saturated atoms


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